The delidding of a chiplet is a tricky process regardless of the number of components, and if you’re not careful, you risk permanently hampering the firmware and its performance. However, several users work their way around it, revealing a ton about the construction and design of CPU chipsets.
Twitter user @Madness7771 posted a picture of AMD’s delidded Ryzen 7 5800X3D CPU for the first time.
The 5800X3D features a CCD and an IOD with capacitors in the surrounding. Like other Ryzen 5000 series CPUs, it has an indium soldered design and gold plated solder for heat transfer between IHS and the chiplets.
The no-contact points of the CPU, like the spot for a second CCD, are protected using silicon.
The Ryzen 7 5800X3D features a thin and sensitive L3 SRAM cache in a 3D-designed package. The clock frequency and main voltage of CCD have been lowered to avoid overheating damage to the V-Cache. Hence, overclocking is not officially featured by AMD. The V-Cache can withstand high temperatures regardless.
Putting the delidded chiplet under the heatsink will apply pressure and create hot air pockets or cause physical damage.
There has been no detailed report on how the 5800X3D performs after the deciding process. However, since there has been no report about an overheated chip, the performance must not be affected as much.
About Advanced Micro Devices
Advanced Micro Devices (AMD) is an American multinational semiconductor company headquartered in Santa Clara, California.
AMD develops computer processors and related technologies for business and consumer markets. AMD’s main products include microprocessors, motherboard chipsets, embedded processors and graphics processors for servers, workstations, personal computers and embedded system applications.
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