The launch of the Ryzen 9 7000 X3D CPUs is just a week away due to which MSI has already started updating their motherboards in order to support the upcoming chips.
MSI rolled out AGESA 1.0.0.5c BIOS update for its X670 & B650 motherboards, also enabling support for the upcoming chips. This update consists of Enhanced Boost Mode and High-Efficiency Mode aside from compatibility which offers a better and optimized performance.
The new BIOS is fine-tuned especially for X3D class chips with 3D V-Cache which helps in enabling three new features for them which includes the Enhanced Boost and High-Efficiency Modes.
Below you’ll find the full description of the MSI AGESA 1.0.0.5c BIOS firmware and it features:
1. Update to SMU 218 which has optimized performance for Ryzen 7950X3D and 7900X3D
2. New feature: Enhanced Boost Mode – MSI PBO profiles for better 7950X3D/7900X3D performance
3. New feature: High-Efficiency Mode for tight RAM timings and better RAM performance
The Enhanced Mode Boost will be found within the Precision Boost Overdrive (PBO) and the High-Efficiency Mode will be available in the OC menu. MSI is expected to release more details regarding the new feature in the coming days.
Take a look at the tweet below:
It’s worth noting that the AMD Ryzen 7000 X3D CPUs will be launched with the Ryzen 9 lineup on February 28th. On the other hand, the AMD Ryzen 7 7800X3D CPU will be available on April 6th and that is the CPU for which gamers are eagerly waiting.
About MSI
MSI is a world leader in gaming, content creation, business & productivity and AIoT solutions. Bolstered by its cutting-edge R&D capabilities and customer-driven innovation, MSI has a wide-ranging global presence spanning over 120 countries. Its comprehensive lineup of laptops, graphics cards, monitors, motherboards, desktops, peripherals, servers, IPCs, robotic appliances, and vehicle infotainment and telematics systems are globally acclaimed.
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